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Semiconductor
DG181 thru DG191
High-Speed Drivers with JFET Switch
Description
The DG181 thru DG191 series of analog gates consist of 2 or 4 N-channel junction-type field-effect transistors (JFET) designed to function as electronic switches. Level-shifting drivers enable low-level inputs (0.8V to 2V) to control the ON-OFF state of each switch. The driver is designed to provide a turn-off speed which is faster than turn-on speed, so that break-before-make action is achieved when switching from one channel to another. In the ON state, each switch conducts current equally well in both directions. In the OFF condition, the switches will block voltages up to 20V peak-to-peak. Switch-OFF input-output isolation 50dB at 10MHz, due to the low output impedance of the FET-gate driving circuit.
T CT DUC PRO PRODU TE OLE UTE 045 April 1999 OBS UBSTIT 49, HI-5151 S 0 , IH5 E I-5 SIBL G185: H I-5051 IH5043 POS , D 403, H I-0390, 84 Features DG1 90: DG 043, H G1 : HI-5 D 91 * Constant ON-Resistance for Signals to 10V (DG182, DG1
DG185, DG188, DG191), to 7.5V (All Devices) * 15V Power Supplies * <2nA Leakage from Signal Channel in Both ON and OFF States * TTL, DTL, RTL Direct Drive Compatibility * tON, tOFF <150ns, Break-Before-Make Action * Cross-Talk and Open Switch Isolation >50dB at 10MHz (75 Load)
Functional Diagrams (Typical Channel)
DG186, DG187, DG188 - ONE AND TWO CHANNEL SPDT AND SPST CIRCUIT CONFIGURATION
VL V+
DG183, DG184, DG185 - TWO CHANNEL DPST CIRCUIT CONFIGURATION
VL V+
IN
S1 D1
IN
S D
S2 D2
S D
GND
V-
GND
V-
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper I.C. Handling Procedures. Copyright
(c) Harris Corporation 1999
File Number
3114.4
1
DG181 Series Part Number Information
PART NUMBER DG181AA DG181AA/883B DG181AP DG181AP/883B DG181BA DG181BP DG182AA DG182AA/883B DG182AP DG182AP/883B DG182BA DG182BP DG184AP DG184AP/883B DG184BP DG185AP DG185AP/883B DG185BP TYPE Dual SPST Dual SPST Dual SPST Dual SPST Dual SPST Dual SPST Dual SPST Dual SPST Dual SPST Dual SPST Dual SPST Dual SPST Dual DPST Dual DPST Dual DPST Dual DPST Dual DPST Dual DPST RDS(ON) (MAX) 30 30 30 30 30 30 75 75 75 75 75 75 30 30 30 75 75 75 PACKAGE 10 Lead CAN 10 Lead CAN 14 Lead SBDIP 14 Lead SBDIP 10 Lead CAN 14 Lead SBDIP 10 Lead CAN 10 Lead CAN 14 Lead SBDIP 14 Lead SBDIP 10 Lead CAN 14 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP
Part Number Information (Continued)
PART NUMBER DG187AA DG187AA/883B DG187AP DG187AP/883B DG187BA DG187BP DG188AA DG188AA/883B DG188AP DG188AP/883B DG188BA DG188BP DG190AP DG190AP/883B DG190BP DG191AP DG191AP/883B DG191BP TYPE SPDT SPDT SPDT SPDT SPDT SPDT SPDT SPDT SPDT SPDT SPDT SPDT Dual SPDT Dual SPDT Dual SPDT Dual SPDT Dual SPDT Dual SPDT RDS(ON) (MAX) 30 30 30 30 30 30 75 75 75 75 75 75 30 30 30 75 75 75 PACKAGE 10 Lead CAN 10 Lead CAN 14 Lead SBDIP 14 Lead SBDIP 10 Lead CAN 14 Lead SBDIP 10 Lead CAN 10 Lead CAN 14 Lead SBDIP 14 Lead SBDIP 10 Lead CAN 14 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP 16 Lead SBDIP
2
DG181 Series Pinouts and Switching State Diagrams
DUAL SPST - DG181, DG182 (TO-100 METAL CAN) TOP VIEW
S2 S1 1 S1 10 1 9 D2 D1 2 NC 3 D1 2 8 IN2 NC 4 IN1 5 V+ 6 V+ 4 5 VL 6 GND VL 7 14 S2 13 D2 12 NC 11 NC 10 IN2 9 V8 GND
DUAL SPST - DG181, DG182 (CDIP) TOP VIEW
IN1
3
7
V-
DUAL DPST - DG184, DG185 (CDIP) TOP VIEW
D1 NC D3 S3 S4 D4 NC D2 1 2 3 4 5 6 7 8 16 S1 15 IN1 14 V13 GND 12 VL 11 V+ 10 IN2 9 S2 IN 3 S1 2
SPDT - DG187, DG188 (TO-100 METAL CAN) TOP VIEW
D2 D1 10 1 9 S2
8
NC
7 4 5 VL 6
V-
V+
GND
SPDT - DG187, DG188 (CDIP) TOP VIEW
NC 1 NC 2 D1 3 S1 4 IN 5 V+ 6 VL 7 14 NC 13 NC 12 D2 11 S2 10 NC 9 V8 GND
DUAL SPDT - DG190, DG191 (CDIP) TOP VIEW
D1 NC D3 S3 S4 D4 NC D2 1 2 3 4 5 6 7 8 16 S1 15 IN1 14 V13 GND 12 VL 11 V+ 10 IN2 9 S2
3
DG181 Series
Absolute Maximum Ratings
V+ - V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36V V+ - VD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33V VD - V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33V VD - VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22V VL - V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36V VL - VIN, VL - GND, VIN - GND . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V GND - V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27V GND - VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V Current (S or D) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200mA Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . -65oC to +150oC Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . +300oC
Thermal Information
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oC Maximum Power Dissipation TO Metal Can Packages . . . . . . . . . . . . . . . . . . . . . . . . . . 450mW Derate 6mW/ oC above +75oC Ceramic DIP Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . 825mW Derate 11mW/ oC above +75oC Device mounted with all leads welded or soldered to PC board.
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications
PARAMETER SWITCH IS(OFF) DG181, DG182, DG184, DG185, DG187, DG188, DG190, DG191 DG181, DG184, DG187, DG190 DG182, DG185, DG188, DG191 ID(OFF) DG181, DG182, DG184, DG185, DG187, DG188, DG190, DG191 DG181, DG184, DG187, DG190 DG182, DG185, DG188, DG191 ID(ON) + IS(ON) DG181, DG184, DG187, DG190 DG182, DG185, DG188, DG191 INPUT IINL IINH DYNAMIC tON tOFF CS(OFF) CD(ON) + CS(ON) OFF Isolation 30 Switches 75 Switches 30 and 75 Switches DG181, DG182, DG184, DG185, DG187, DG188, DG190, DG191 All All DEVICE NUMBER
V+ = +15V, V- = -15V, VL = 5V, Unless Otherwise Specified (NOTE 1) TEST CONDITIONS VS = 10V, VD = -10V, V+ = 10V, V- = -20V, VIN = "OFF" VS = 7.5V, VD = -7.5V, VIN = "OFF" VS = 10V, VD = -10V, VIN = "OFF" VS = 10V, VD = -10V, V+ = 10V, V- = -20V, VIN = "OFF" VS = 7.5V, VD = -7.5V, VIN = "OFF" VS = 10V, VD = -10V, VIN = "OFF" VD = VS = -7.5V, VIN = "ON" VD = VS = -10V, VIN = "ON" A SERIES -55oC +25oC 1 +125oC 100 -20oC B SERIES +25oC 5 +85oC 100 UNITS nA
-
1 1 1
100 100 100
-
5 5 5
100 100 100
nA nA nA
-
1 1 2 2
100 100 -200 -200
-
5 5 -10 -10
100 100 -200 -200
nA nA nA nA
VIN = 0V VIN = 5V See Switching Time Test Circuit
-250 -
-250 10 150 250 130
-250 20 -
-250 -
-250 10 180 300 150
-250 20 -
A A ns ns ns pF pF pF -
VS = -5V, ID = 0, f = 1MHz VD = +5V, IS = 0, f = 1MHz VD = VS = 0, f = 1MHz RL = 75, CL = 3pF
9 Typical 6 Typical 14 Typical Typically >50dB at 10MHz
4
DG181 Series
Electrical Specifications
PARAMETER SUPPLY I+ DG181, DG182, DG190, DG191 DG184, DG185 DG187, DG188 IDG181, DG182, DG190, DG191 DG184, DG185 DG187, DG188 IL DG181, DG182, DG184, DG185, DG190, DG191 DG187, DG188 IGND I+ All DG181, DG182, DG190, DG191 DG184, DG185 DG187, DG188 IDG181, DG182, DG190, DG191 DG184, DG185 DG187, DG188 IL DG181, DG182, DG184, DG185, DG190, DG191 DG187, DG188 IGND NOTE: 1. See Switching State Diagrams for VIN "ON" and VIN "OFF" Test Conditions. All VIN = 0V VIN = 5V 1.5 0.1 0.8 -5.0 -4.0 -3.0 4.5 1.5 0.1 0.8 -5.0 -4.0 -3.0 4.5 mA mA mA mA mA mA mA DEVICE NUMBER V+ = +15V, V- = -15V, VL = 5V, Unless Otherwise Specified (Continued) (NOTE 1) TEST CONDITIONS A SERIES -55oC +25oC +125oC -20oC B SERIES +25oC +85oC UNITS
-
3.2 -2.0 1.5 3.0 0.8 -5.0 -5.5 -3.0 4.5
-
-
3.2 -2.0 1.5 3.0 0.8 -5.0 -5.5 -3.0 4.5
-
mA mA mA mA mA mA mA mA mA
-
3.2 -2.0
-
-
3.2 -2.0
-
mA mA
Electrical Specifications
DEVICE NUMBER DG181 DG182 DG184 DG185 DG187 DG188 DG190 DG191 NOTES:
Maximum Resistances (RDS(ON) MAX) MILITARY TEMPERATURE -55oC 30 75 30 75 30 75 30 75 +25oC 30 75 30 75 30 75 30 75 +125oC 60 100 60 150 60 150 60 150 50 100 50 100 50 100 50 100 INDUSTRIAL TEMPERATURE -20oC +25oC 50 100 50 100 50 100 50 100 +85oC 75 150 75 150 75 150 75 150 UNITS
TEST CONDITIONS (NOTE 1) V+ = 15V, V- = -15V, VL = 5V VD = -7.5V VD = -10V VD = -7.5V VD = -10V VD = -7.5V VD = -10V VD = -7.5V VD = -10V IS = -10mA, VIN = "ON"
1. See Switching State Diagrams for VIN "ON" and VIN "OFF" Test Conditions. 2. Normally the minimum signal handling capability of the DG181 thru DG191 family is 20V peak to peak for the 75 switches and 15V peakto-peak for the 30 (refer ID and IS tests above). 3. For other Analog Signals, the following guidelines can be used: proper switch turn-off requires that V- VANALOG(peak) - VP where VP = 7.5V for the 80 switches and VP = 5.0V for 75 switches e.g., - 10V minimum (-peak) analog signal and a 75 switch (VP = 5V), requires that V- -10V -5V = -15V.
5
DG181 Series
DUAL SPST - DG181/182
TEST CONDITIONS VIN "ON" = 0.8V VIN "OFF" = 2.0V NOTE: 1. Switch states are for logic "1" input = 2.0V. All Channels All Channels VIN "ON" = 2.0V VIN "OFF" = 0.8V NOTE: 1. Switch states are for logic "1" input = 2.0V.
DUAL DPST - DG184/185
TEST CONDITIONS All Channels All Channels
SPDT - DG187/188
TEST CONDITIONS VIN "ON" = 2.0V VIN "ON" = 0.8V VIN "OFF" = 2.0V VIN "OFF" = 0.8V NOTE: 1. Switch states are for logic "1" input = 2.0V. Channel 1 Channel 2 Channel 2 Channel 1
SPDT - DG190/191
TEST CONDITIONS VIN "ON" = 2.0V VIN "ON" = 0.8V VIN "OFF" = 2.0V VIN "OFF" = 0.8V NOTE: 1. Switch states are for logic "1" input = 2.0V. Channel 1 and 2 Channel 3 and 4 Channel 3 and 4 Channel 1 and 2
Switching Time Test Circuits
+5V VL LOGIC 3V INPUT tR < 10ns tF < 10ns SWITCH V INPUT S 90% SWITCH 0V OUTPUT 90% GND V-15V (REPEAT TEST FOR ALL CHANNELS) VO = VS RL RL + RDS(ON) 0V SWITCH INPUT S1 +15V VCC D1 SWITCH OUTPUT VO CL 30pF
50%
50%
tON, VS = +10V tOFF, VS = -10V
LOGIC INPUT
IN1
RL 1k
t ON
t OFF
0V
FIGURE 1. SWITCHING TIME TEST WAVEFORMS (Note 1) NOTES:
FIGURE 2. SWITCHING TIME TEST CIRCUIT (Note 2)
1. Switch output waveform shown for VS = constant with logic input waveform as shown. 2. VS may be + or - as per switching time test circuit. VO is the steady state output with switch on. Feedthrough via gate capacitance may result in spikes at leading and trailing edge of output waveform.
6
DG181 Series Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1 -A-DBASE METAL b1 M (b) SECTION A-A (c) LEAD FINISH
D14.3 MIL-STD-1835 CDIP2-T14 (D-1, CONFIGURATION C)
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE INCHES SYMBOL A b b1 b2 b3 MIN 0.014 0.014 0.045 0.023 0.008 0.008 0.220 MAX 0.200 0.026 0.023 0.065 0.045 0.018 0.015 0.785 0.310 MILLIMETERS MIN 0.36 0.36 1.14 0.58 0.20 0.20 5.59 MAX 5.08 0.66 0.58 1.65 1.14 0.46 0.38 19.94 7.87 NOTES 2 3 4 2 3 5 6 7 2 8 Rev. 0 4/94
E M -Bbbb S C A - B S BASE PLANE SEATING PLANE S1 b2 b AA D S2 -CQ A L DS
c c1 D eA E e eA eA/2
e
eA/2
c
0.100 BSC 0.300 BSC 0.150 BSC 0.125 0.015 0.005 0.005 90o 14 0.200 0.060 105o 0.015 0.030 0.010 0.0015
2.54 BSC 7.62 BSC 3.81 BSC 3.18 0.38 0.13 0.13 90o 14 5.08 1.52 105o 0.38 0.76 0.25 0.038
ccc M C A - B S D S
aaa M C A - B S D S
NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH.
L Q S1 S2
aaa bbb ccc M N
7
DG181 Series Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1 -A-DBASE METAL b1 M (b) SECTION A-A (c) LEAD FINISH
D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C)
16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE INCHES SYMBOL A b b1 b2 b3 MIN 0.014 0.014 0.045 0.023 0.008 0.008 0.220 MAX 0.200 0.026 0.023 0.065 0.045 0.018 0.015 0.840 0.310 MILLIMETERS MIN 0.36 0.36 1.14 0.58 0.20 0.20 5.59 MAX 5.08 0.66 0.58 1.65 1.14 0.46 0.38 21.34 7.87 NOTES 2 3 4 2 3 5 6 7 2 8 Rev. 0 4/94
E M -Bbbb S C A - B S BASE PLANE SEATING PLANE S1 b2 b AA D S2 -CQ A L DS
c c1 D eA E e eA eA/2
e
eA/2
c
0.100 BSC 0.300 BSC 0.150 BSC 0.125 0.015 0.005 0.005 90o 16 0.200 0.060 105o 0.015 0.030 0.010 0.0015
2.54 BSC 7.62 BSC 3.81 BSC 3.18 0.38 0.13 0.13 90o 16 5.08 1.52 105o 0.38 0.76 0.25 0.038
ccc M C A - B S D S
aaa M C A - B S D S
NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH.
L Q S1 S2
aaa bbb ccc M N
8
DG181 Series Metal Can Packages (Can)
REFERENCE PLANE A L L2 L1 A A OD OD1 Oe 2 1 Ob1 Ob BASE AND SEATING PLANE BASE METAL LEAD FINISH N k1 OD2
T10.B MIL-STD-1835 MACY1-X10 (A2)
e1 10 LEAD METAL CAN PACKAGE INCHES SYMBOL A Ob Ob1 Ob2 OD MIN 0.165 0.016 0.016 0.016 0.335 0.305 0.110 MAX 0.185 0.019 0.021 0.024 0.375 0.335 0.160 MILLIMETERS MIN 4.19 0.41 0.41 0.41 8.51 7.75 2.79 MAX 4.70 0.48 0.53 0.61 9.52 8.51 4.06 NOTES 1 1 2 1 1 1 3 3 4 Rev. 0 5/18/94
k
OD1
C L
F Q
OD2 e e1 F k k1
0.230 BSC 0.115 BSC 0.027 0.027 0.500 0.250 0.010 36o BSC 36o BSC 10 0.040 0.034 0.045 0.750 0.050 0.045 -
5.84 BSC 2.92 BSC 1.02 0.86 1.14 19.05 1.27 1.14
0.69 0.69 12.70 6.35 0.25
Ob1
Ob2
L L1
SECTION A-A
L2 Q
NOTES: 1. (All leads) Ob applies between L1 and L2. Ob1 applies between L2 and 0.500 from the reference plane. Diameter is uncontrolled in L1 and beyond 0.500 from the reference plane. 2. Measured from maximum diameter of the product. 3. is the basic spacing from the centerline of the tab to terminal 1 and is the basic spacing of each lead or lead position (N -1 places) from , looking at the bottom of the package. 4. N is the maximum number of terminal positions. 5. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 6. Controlling dimension: INCH.
N
36o BSC 36o BSC 10
9

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